Publikationer
Thermal Aware Test Scheduling for Stacked Multi-Chip-Modules
Avdelning/ar:
Publiceringsår: 2009
Språk: Engelska
Dokumenttyp: Konferensbidrag
Sammanfattning
Disputation
Nyckelord
- Technology and Engineering
Övrigt
<em>DATE 2009 Friday Workshop on 3D Integration - Technology, Architecture, Design, Automation, and Tes
2013-04-21
T, Nice, France
Published
Yes
