Optical Link by Using Optical Wiring Method for Reducing EMI
Författare
Summary, in English
A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy
assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and
susceptibility.
This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the
following steps: (ⅰ) forming a light source device, an optical detection device, and an optical transmission unit on a
substrate (metal optical bench (MOB)); (ⅱ) preparing a flexible optical transmission-connection medium (optical wiring
link) to optically connect the light source device formed on the substrate with the optical detection device; and (ⅲ)
directly connecting one end of the surface-finished optical transmission connection medium with the light source device
and the other end with the optical detection device. Electronic interconnections have uniquely electronic problems such
as EMI, shorting, and ground loops. Since these problems only arise during transduction (electronics-to-optics or opticsto-
electronics), the purely optical part and optical link(interconnection) is free of these problems. 1
An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and
EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust
and cost-effective assembly for reducing EMI of inter-chip interconnect. We successfully achieved a 4.5 Gb/s data
transmission rate without EMI problems.
assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and
susceptibility.
This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the
following steps: (ⅰ) forming a light source device, an optical detection device, and an optical transmission unit on a
substrate (metal optical bench (MOB)); (ⅱ) preparing a flexible optical transmission-connection medium (optical wiring
link) to optically connect the light source device formed on the substrate with the optical detection device; and (ⅲ)
directly connecting one end of the surface-finished optical transmission connection medium with the light source device
and the other end with the optical detection device. Electronic interconnections have uniquely electronic problems such
as EMI, shorting, and ground loops. Since these problems only arise during transduction (electronics-to-optics or opticsto-
electronics), the purely optical part and optical link(interconnection) is free of these problems. 1
An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and
EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust
and cost-effective assembly for reducing EMI of inter-chip interconnect. We successfully achieved a 4.5 Gb/s data
transmission rate without EMI problems.
Publiceringsår
2008
Språk
Engelska
Publikation/Tidskrift/Serie
[Host publication title missing]
Volym
7268
Fulltext
Dokumenttyp
Konferensbidrag
Förlag
SPIE
Ämne
- Electrical Engineering, Electronic Engineering, Information Engineering
Nyckelord
- Interconnect
- electromagnetic interference
- chip-to-chip interconnection
- metal electro-optical bench(MOB)
- optical interconnection technology
- Plastic optical fiber(POF)
- EMI
Conference name
Smart Structures, Devices, and Systems IV
Conference date
2008-12-09
Conference place
Melbourne, Australia
Status
Published
Forskningsgrupp
- Electromagnetic theory
ISBN/ISSN/Övrigt
- ISBN: 9780819475206