Test Planning for Core-based 3D Stacked ICs with Through-Silicon Vias
Publikation/Tidskrift/Serie: [Host publication title missing]
Förlag: IEEE--Institute of Electrical and Electronics Engineers Inc.
Test planning for core-based 3D stacked ICs with trough-silicon vias (3D TSV-SIC) is different from test planning for non-stacked ICs as the same test schedule cannot be applied both at wafer sort and package test. In this paper, we assume a test flow where each chip is tested individually at wafer sort and jointly at package test. We define cost functions and test planning optimization algorithms for non-stacked ICs, 3D TSV-SICs with two chips and 3D TSV-SICs with an arbitrary number of chips. We have implemented our techniques and experiments show significant reduction of test cost.
- Electrical Engineering, Electronic Engineering, Information Engineering
- Test Scheduling
- 3D stacked IC
- Test Architecture
- Through Silicon Via
2012 25th International Conference on VLSI Design
- Digital ASIC-lup-obsolete