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Simulation of discontinuous dynamic recrystallization in pure Cu using a probabilistic cellular automaton

In English

Författare

Summary, in English

A cellular automaton algorithm with probabilistic cell switches is employed in the simulation of dynamic discontinuous recrystallization. Recrystallization kinetics are formulated on a microlevel where, once nucleated, new grains grow under the driving pressure available from the competing processes of stored energy minimization and boundary energy reduction. Simulations of the microstructural changes in pure Cu under hot compression are performed where the influence of different thermal conditions are studied. The model is shown to capture both the microstructural evolution in terms of grain size and grain shape changes and also the macroscopic flow stress behavior of the material. The latter gives the expected transition from single- to multiple-peak serrated flow with increasing temperature. Further, the effects on macroscopic flow stress by varying the initial grain size is analyzed and the model is found to replicate the shift towards more serrated flow as the initial grain size is reduced. Conversely, the flow stress is stabilized by larger initial grain sizes. The extent of recrystallization as obtained from simulations are compared to classical JMAK theory and proper agreement with theory is established. In addition, by tracing the strain state during the simulations, a post-processing step is devised to obtain the macroscopic deformation of the cellular automaton domain, giving the expected deformation of the equiaxed recrystallized grains due to the macroscopic compression.

Avdelning/ar

Publiceringsår

2010

Språk

Engelska

Sidor

25-34

Publikation/Tidskrift/Serie

Computational Materials Science

Volym

49

Issue

1

Dokumenttyp

Artikel i tidskrift

Förlag

Elsevier, Elsevier

Ämne

  • Mechanical Engineering

Nyckelord

  • Hot compression
  • Recrystallization
  • Cellular automaton
  • Copper

Status

Published

Projekt

  • Multiscale modeling of recrystallization

ISBN/ISSN/Övrigt

  • ISSN: 0927-0256