Measurement Point Selection for In-Operation Wear-Out Monitoring
Publikation/Tidskrift/Serie: 14th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS11)
In recent IC designs, the risk of early failure due to electromigration wear-out has increased due to reduced feature dimensions. To give a warning of impending failure, wearout monitoring approaches have included delay measurement circuitry on-chip. Due to the high cost of delay measurement circuitry this paper presents a method to reduce the number of necessary measurement points. The proposed method is based on identification of wear-out sensitive interconnects and selects a small number of measurement points that can be used to observe the state of all the wear-out sensitive interconnects. The method is demonstrated on ISCAS85 benchmark ICs with encouraging results.
- Electrical Engineering, Electronic Engineering, Information Engineering
14th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS11)
- ISBN: 978-1-4244-9755-3