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Measurement Point Selection for In-Operation Wear-Out Monitoring

Publiceringsår: 2011
Språk: Engelska
Dokumenttyp: Konferensbidrag


In recent IC designs, the risk of early failure due to electromigration wear-out has increased due to reduced feature dimensions. To give a warning of impending failure, wearout monitoring approaches have included delay measurement circuitry on-chip. Due to the high cost of delay measurement circuitry this paper presents a method to reduce the number of necessary measurement points. The proposed method is based on identification of wear-out sensitive interconnects and selects a small number of measurement points that can be used to observe the state of all the wear-out sensitive interconnects. The method is demonstrated on ISCAS85 benchmark ICs with encouraging results.



  • Electrical Engineering, Electronic Engineering, Information Engineering


14th IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS11)
Cottbus, Germany,

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