Power Constrained Test Scheduling for 3D Stacked Chips: poster
Författare
Publiceringsår
2010
Språk
Engelska
Fulltext
- Available as PDF - 13 MB
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Dokumenttyp
Affisch
Ämne
- Electrical Engineering, Electronic Engineering, Information Engineering
Conference name
1st IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits
Conference date
2010-11-04 - 2010-11-05
Conference place
Austin, United States
Status
Published
Forskningsgrupp
- Digital ASIC