Sloped side walls in SU-8 structures with ‘Step-and-Flash’ processing
Publikation/Tidskrift/Serie: Microelectronic Engineering
We present a fast fabrication technique to achieve SU-8 structures with sloped side walls. We investigate the method of ‘Step-and-Flash’ which combines hot embossing with UV sensitive materials. The stamps are fabricated in Si by KOH etching to achieve mesa structures with side walls at a 54.7° angle to the bottom. These stamps are imprinted into SU-8-coated Pyrex wafers during the soft bake step of the SU-8 processing, under ambient conditions. The SU-8 is exposed through the Pyrex wafer and after a post exposure bake the stamp can be removed as the SU-8 is cross-linked – leaving stamp replicates in the SU-8. We have optimized the method and show that further processing of the structures is possible. We believe this method to be highly suitable for pattering sloped side wall structures in SU-8 as it can easily be incorporated into a standard SU-8 fabrication scheme without adding further process steps, as well as performed under ambient conditions.
- Technology and Engineering
- ISSN: 0167-9317