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Investigation of the bond strength between the photo-sensitive polymer SU-8 and gold

  • Maria Nordström (Dr)
  • Alicia Johansson
  • Encarnacion Sánchez Noguerón
  • Bjarne Clausen
  • Montserrat Calleja
  • Anja Boisen
Publiceringsår: 2005
Språk: Engelska
Sidor: 152-157
Publikation/Tidskrift/Serie: Microelectronic Engineering
Volym: 78/79
Dokumenttyp: Artikel
Förlag: Elsevier


We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and Au. The data were obtained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that we investigated were: (i) the effect of using different adhesion promoters between the SU-8 and Au; (ii) the influence of the processing sequence, keeping either Au or SU-8 as the bottom layer; (iii) the importance of the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. For SU-8 and Au without any adhesion promoter we find a bond strength of 4.8 ± 1.2 MPa for a 7.5-μm-layer of SU-8. The value of the bond strength can be increased additionally by up to 75% using an adhesion promoter and fully optimising the processing conditions of the SU-8.



  • Technology and Engineering


  • ISSN: 0167-9317

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