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Investigation of polymethylmethacrylate resist residues using photoelectron microscopy

Publiceringsår: 2002
Språk: Engelska
Sidor: 1139-1142
Publikation/Tidskrift/Serie: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
Volym: 20
Nummer: 3
Dokumenttyp: Konferensbidrag
Förlag: American Institute of Physics

Sammanfattning

Quantitative photoelectron spectromicroscopy has been used to study polymethylmethacrylate (PMMA) resist residues on SiO2 surfaces after electron beam exposure and resist development, It was found that correctly exposed and developed PMMA leaves residues with an average thickness of about 1 nm. Higher exposure doses result in the decrease in film thickness, but with residues of about 0.5 mn. The technique can be applied as a powerful tool for surface and interface quality control in technology of electronic devices.

Disputation

Nyckelord

  • Physics and Astronomy

Övrigt

20th North American Conference on Molecular Beam Epitaxy
2014-10-02
Providence, RI
Published
Yes
  • ISSN: 1071-1023

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